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user@intervues:~/experiences/…$
Level: Senior-Level
Round: Full Journey · Type: Multiple Types · Difficulty: 6/10 · Duration: 360 min · Interviewer: Unfriendly
Topics: Consumer Electronics, Injection Molding, Thermal Management, GD&T, Cantilever Beam, Cross-functional Communication, Product Design, Behavioral Questions
Location: San Francisco Bay Area
Interview date: 2025-12-27
Got offer: False
After applying for a job on LinkedIn, an HR representative from Meta contacted me and scheduled a phone screen. The phone screen focused on my motivations for transitioning to Consumer Electronics and my suitability for the role.
Following the phone screen, I had a technical interview with a good interviewer. This round covered injection molding, including defect resolution and joining methods, as well as basic thermal path considerations for heat dissipation. I felt my answers were a bit hesitant, but I passed.
Next was the virtual panel interview, consisting of five rounds across two days:
During the technical interviews, I was asked about:
The behavioral interviewer did not show up after the two technical rounds on the first day. I emailed the coordinator, who said it would be rescheduled for Friday, but I received no further communication.
Both rounds on the second day had shadows. The interviewers for the partnership and design rounds were late by 5 and 7 minutes, respectively. The partnership round involved questions about communication in cross-functional teams and conflict resolution. The design round covered the assembly and heat dissipation of a handheld product and lasted 50 minutes.